| Technology Project | Process Capability | Technology Project | Process Capability |
| Plate type | FR-4 glass fiber board Aluminum substrate Copper substrate | Curvature | 0.5% (350X350) |
| Thermal Conductivity | 1.0w/1.5w/2.0w/4.0w/8.0w/122w | Test withstand voltage | AC1500-4000V |
| Substrate thickness | 0.2-5.0mm | Copper foil thickness | 18um/35um/70um/105um |
| Surface treatment | Lead-free tin Immersion gold OSP antioxidant | Forming method | CNC computer gong Die punch Computer V-CUT |
| Biggest size | 1500x500mm | Shape tolerance | CNC: ± 0.1-0.15mm Die punch: ± 0.1mm Laser cutting: 0.05mm |
| Smallest size | 5x5mm | ||
| Minimum line width | 0.1mm (4mil) | Solder mask type | White oil various color solder resist oil |
| Minimum line spacing | 0.1mm (4mil) | Production Process | Exposure process |
| Minimum aperture | 0.25mm | Monthly capacity | 30,000 square meters |
| E-T test | 100% computer open and short test | Delivery time | Sample: 5-6 days Batch: 8-12 days |
| Max Size | Value |
| Maximum board | 510mm * 460mm |
| Maximum plate thickness | 5mm |
| Minimum plate thickness | 0.2mm |
| Maximum placement part weight | 150g |
| Maximum part height | 25mm |
| Maximum part size | 150mm * 150mm |
| Maximum part placement accuracy (100QFP) | 25um @ IPC |
| smallest size | Value |
| Minimum Chip Parts | 01005 Package |
| Minimum lead part pitch | 0.3pitch |
| Minimum ball part (BGA) pitch | 0.25pitch |
| Minimum spherical part (BGA) ball diameter | 0.25mm |
| Maximum Capacity | Value |
| Maximum production capacity | 300 million parts / month |
| Specialty | BGA placement and rich POP process capability |
