Availability: | |
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Quantity: | |
PCBA process capability introduction
classification | Technology Project | technical skills |
Max | The largest board | 510*460mm |
Maximum board thickness | 0.2~5.0mm | |
Maximum mounted part weight | 150g | |
Maximum part height | 25mm | |
Minimum | Smallest chip part | 01005 package |
Minimum lead part spacing | 0.3pitch | |
Minimum ball-shaped parts (BGA) spacing | 0.25pitch | |
Minimum ball diameter (BGA) | 0.25mm | |
Capacity | Maximum capacity | 300 million parts/month |
Specialty | BGA placement and rich POP process capabilities |
SMT patch introduction
Big category | Technical name | technical skills |
Max | The largest board | 510*460mm |
Maximum board thickness | 0.2~5.0mm | |
Maximum mounted part weight | 150g | |
Maximum part height | 25mm | |
Minimum | Smallest chip part | 01005 package |
Minimum lead part spacing | 0.3 pitch | |
Minimum ball-shaped parts (BGA) spacing | 0.25 pitch | |
Minimum ball diameter (BGA) | 0.25mm | |
Capacity | Maximum capacity | 300 million parts/month |
Specialty | BGA placement and rich POP process capabilities |
PCBA process capability introduction
classification | Technology Project | technical skills |
Max | The largest board | 510*460mm |
Maximum board thickness | 0.2~5.0mm | |
Maximum mounted part weight | 150g | |
Maximum part height | 25mm | |
Minimum | Smallest chip part | 01005 package |
Minimum lead part spacing | 0.3pitch | |
Minimum ball-shaped parts (BGA) spacing | 0.25pitch | |
Minimum ball diameter (BGA) | 0.25mm | |
Capacity | Maximum capacity | 300 million parts/month |
Specialty | BGA placement and rich POP process capabilities |
SMT patch introduction
Big category | Technical name | technical skills |
Max | The largest board | 510*460mm |
Maximum board thickness | 0.2~5.0mm | |
Maximum mounted part weight | 150g | |
Maximum part height | 25mm | |
Minimum | Smallest chip part | 01005 package |
Minimum lead part spacing | 0.3 pitch | |
Minimum ball-shaped parts (BGA) spacing | 0.25 pitch | |
Minimum ball diameter (BGA) | 0.25mm | |
Capacity | Maximum capacity | 300 million parts/month |
Specialty | BGA placement and rich POP process capabilities |