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CU02
CZY
| Technical Projects | Capabilities | Technical Projects | Capabilities |
| Material | aluminum substrate / copper substrate / copper aluminum composite plate /FR-4 | Panel Bow & Twist | 0.5%（size: 350*350MM） |
Thermal Conductivity | 1.0W/1.5W/2.0W/4.0W/8.0W/122W | Panel Bending Angle | 30° 45° 90° etc. |
| Plate Thickness | 0.2-5.0MM | Withstand Voltage | AC1500-4000V |
| Surface Treatment | LF HASL / Immersion Gold /OSP | Copper Foil Thickness | 25um 35um 70um 105um |
| Maximum Size | 1500*500MM | Molding | CNC / Die Punching / V-CUT / Laser Cutting |
| Minimum Size | 5MM*5MM | External Tolerance | CNC: ±0.1-0.15MM Die Punching: ±0.125MM Laser Cutting: ±0.05MM |
| Min Line Width | 0.1MM(4mil) | Solder Mask | white or customize |
| Min Line Space | 0.1MM(4mil) | Processing | exposure / thermoelectric separation |
| Min Hole | ∮1.6mm | Monthly Capacity | 20,000 m2 |
| E-T Test | 100% computer short circuit test | Lead Time | aluminum sample 2~3D, batch 5~8D; copper sample 6D, batch 8~12D |
| Technical Projects | Capabilities | Technical Projects | Capabilities |
| Material | aluminum substrate / copper substrate / copper aluminum composite plate /FR-4 | Panel Bow & Twist | 0.5%（size: 350*350MM） |
Thermal Conductivity | 1.0W/1.5W/2.0W/4.0W/8.0W/122W | Panel Bending Angle | 30° 45° 90° etc. |
| Plate Thickness | 0.2-5.0MM | Withstand Voltage | AC1500-4000V |
| Surface Treatment | LF HASL / Immersion Gold /OSP | Copper Foil Thickness | 25um 35um 70um 105um |
| Maximum Size | 1500*500MM | Molding | CNC / Die Punching / V-CUT / Laser Cutting |
| Minimum Size | 5MM*5MM | External Tolerance | CNC: ±0.1-0.15MM Die Punching: ±0.125MM Laser Cutting: ±0.05MM |
| Min Line Width | 0.1MM(4mil) | Solder Mask | white or customize |
| Min Line Space | 0.1MM(4mil) | Processing | exposure / thermoelectric separation |
| Min Hole | ∮1.6mm | Monthly Capacity | 20,000 m2 |
| E-T Test | 100% computer short circuit test | Lead Time | aluminum sample 2~3D, batch 5~8D; copper sample 6D, batch 8~12D |
